ATMIX had developed the efficient production process for super fine Cu powder D50: 1-2µm by original high pressure water atomization technology and can supply high quality and low price super fine Cu powder.

Characteristics of Super Fine Cu Powder

High Purity & Clean Surface

Stability of Oxygen Content

Spherical Shape

Typical Properties of Powder

  Particle size
(µm)
TD
(g/cm3)
Oxygen
Contents
(ppm)
Specific
Surface area
(m2/g)
D10 D50 D90
PF-1F 1.1 1.8 3.2 4.6 1,800 0.68
PF-2F 1.4 2.6 4.6 4.9 1,400 0.47
PF-3F 1.8 3.4 5.9 5.0 1,200 0.41
PF-7F 2.2 4.9 10.0 5.1 1,000 0.32

* Measurement of particle size : Microtrac (HRA mode)

Shape of Powder

Particle size Distribution

Main Application

Conductive Paste
- MLCC Terminal Electrode
- LTCC
- Printed Wiring Board