Pure copper MIM

Advantage

・Our original MIM sintering technology controls oxygen content. We have achieved high thermal conductivity equivalent to that of oxygen-free copper.

Product:Heat dissipation package component Product:Heat dissipation package component
External dimensions:45×25×t10mm
Fin thickness:0.6mm
Side thickness:2.0mm

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Inquiries and technical questions about products, please contact us from the following e-mail address.
[ atmix_mim@exc.epson.co.jp ]