Pure copper MIM


・Our original MIM sintering technology controls oxygen content. We have achieved high thermal conductivity equivalent to that of oxygen-free copper.

Product:Heat dissipation package component Product:Heat dissipation package component
External dimensions
Fin thickness
Side thickness
: 45×25×t10mm
: 0.6mm
: 2.0mm
External dimensions
Fin size(minimum)
Pitch between fins
Pin size
Base wall thickness
: 45×55mm
: t0.4×h2.0mm
: 1.0mm
: Φ1.0×h4.0mm
: 3.0mm


Inquiries and technical questions about products, please contact us from the following e-mail address.
[ atmix_mim@exc.epson.co.jp ]